Invention Grant
- Patent Title: In-molded resistive and shielding elements
- Patent Title (中): 嵌入式电阻和屏蔽元件
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Application No.: US13897715Application Date: 2013-05-20
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Publication No.: US09576755B2Publication Date: 2017-02-21
- Inventor: Ronald H. Haag , Jeffrey R. Engel , William W. Boddie, Jr.
- Applicant: T+ink, Inc.
- Applicant Address: US NY New York
- Assignee: T+Ink, Inc.
- Current Assignee: T+Ink, Inc.
- Current Assignee Address: US NY New York
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01C1/03
- IPC: H01C1/03 ; H01H11/04 ; B29C45/14 ; H03K17/96 ; H05K9/00 ; B29L31/46
Abstract:
An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.
Public/Granted literature
- US20130248345A1 IN-MOLDED RESISTIVE AND SHIELDING ELEMENTS Public/Granted day:2013-09-26
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