Invention Grant
- Patent Title: Methods of forming a microshield on standard QFN package
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Application No.: US13036272Application Date: 2011-02-28
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Publication No.: US09576823B2Publication Date: 2017-02-21
- Inventor: Dan Carey , Brian Howard Calhoun
- Applicant: Dan Carey , Brian Howard Calhoun
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H01L21/56 ; H01L23/31 ; H01L23/495 ; H01L23/552 ; H01L23/00
Abstract:
Shielded electronic packages may have metallic lead frames to connect an electromagnetic shield to ground. In one embodiment, a metallic lead frame of the electronic package and a surface of the metallic lead frame defines a component area for attaching an electronic component. The metallic lead frame includes a metallic structure associated with the component area that may have a grounding element for connecting to ground and one or more signal connection elements, such as signal leads, for transmitting input and output signals. The electromagnetic shield connects to the metallic lead frame to safely connect to ground while maintaining the signal connection elements isolated from the shield.
Public/Granted literature
- US09627230B2 Methods of forming a microshield on standard QFN package Public/Granted day:2017-04-18
Information query
