Invention Grant
US09576844B2 Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core
有权
具有石墨芯的复合晶片的制造方法以及具有石墨芯的复合晶片
- Patent Title: Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core
- Patent Title (中): 具有石墨芯的复合晶片的制造方法以及具有石墨芯的复合晶片
-
Application No.: US14962393Application Date: 2015-12-08
-
Publication No.: US09576844B2Publication Date: 2017-02-21
- Inventor: Rudolf Berger , Hermann Gruber , Wolfgang Lehnert , Guenther Ruhl , Raimund Foerg , Anton Mauder , Hans-Joachim Schulze , Karsten Kellermann , Michael Sommer , Christian Rottmair , Roland Rupp
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/762 ; H01L21/02 ; H01L21/20 ; C30B25/18 ; H01L21/324 ; H01L21/265 ; H01L21/321 ; H01L29/16 ; H01L29/20
Abstract:
A composite wafer is manufactured by providing a carrier wafer including graphite and a protective layer, forming a bonding layer, and bonding the carrier wafer to a semiconductor wafer through the bonding layer.
Public/Granted literature
Information query
IPC分类:
