The semiconductor package includes semiconductor chips, each chip having one or more bonding pads. The semiconductor chips are stacked in a stepped configuration over the surface of the substrate without covering one or more bonding pads. An encapsulation member encapsulates the stacked semiconductor chips on the surface of the substrate. Via wirings in the encapsulation member electrically connect to a bonding pad of at least one of the semiconductor chips. Redistributions are formed over the encapsulation member such that the one or more redistributions are electrically coupled to the via wirings.