Invention Grant
- Patent Title: Composition for electronic device
- Patent Title (中): 电子设备组成
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Application No.: US14200525Application Date: 2014-03-07
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Publication No.: US09576871B2Publication Date: 2017-02-21
- Inventor: Yusuke Horiguchi , Kenichiro Sato , Mieko Sano
- Applicant: HENKEL AG & CO KGAA
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL AG & CO. KGAA
- Current Assignee: HENKEL AG & CO. KGAA
- Current Assignee Address: DE Duesseldorf
- Agent James J. Cummings
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/00 ; H01L21/56 ; C09D4/00 ; C09D133/14 ; C08K9/04 ; C08K5/3415

Abstract:
The present invention provides a composition of which viscosity does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to a composition for electronic device comprising (a) a (meth)acrylic compound and (c) a particle having a functional group having metal scavenging functionality.
Public/Granted literature
- US20140187659A1 COMPOSITION FOR ELECTRONIC DEVICE Public/Granted day:2014-07-03
Information query
IPC分类: