Invention Grant
US09576873B2 Integrated circuit packaging system with routable trace and method of manufacture thereof
有权
具有可布线迹线的集成电路封装系统及其制造方法
- Patent Title: Integrated circuit packaging system with routable trace and method of manufacture thereof
- Patent Title (中): 具有可布线迹线的集成电路封装系统及其制造方法
-
Application No.: US13325881Application Date: 2011-12-14
-
Publication No.: US09576873B2Publication Date: 2017-02-21
- Inventor: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- Applicant: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Wong & Rees LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/56 ; H01L23/495 ; H01L21/48 ; H01L25/10 ; H01L23/00
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing routable traces including a first routable trace with a top plate and a second routable trace; mounting an integrated circuit partially over a second routable trace; forming an encapsulation over and around the first routable trace and the integrated circuit; forming a hole through the encapsulation to the top plate; and forming a protective coat directly on the encapsulation with the first routable trace between and in contact with the protective coat and the encapsulation.
Public/Granted literature
- US20130154105A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE TRACE AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2013-06-20
Information query
IPC分类:
