Invention Grant
- Patent Title: Heat-dissipation structure and electronic device using the same
- Patent Title (中): 散热结构和使用其的电子器件
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Application No.: US13589742Application Date: 2012-08-20
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Publication No.: US09576879B2Publication Date: 2017-02-21
- Inventor: Ling Zhang , Chang-Hong Liu , Shou-Shan Fan
- Applicant: Ling Zhang , Chang-Hong Liu , Shou-Shan Fan
- Applicant Address: CN Beijing TW New Taipei
- Assignee: Tsinghua University,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: Tsinghua University,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Beijing TW New Taipei
- Agent Zhigang Ma
- Priority: CN201110432708 20111221
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H05K7/20
Abstract:
A heat-dissipation structure includes a first carbon nanotube layer and a thermal interface material layer. The first carbon nanotube layer and the thermal interface material layer are stacked on each other. The first carbon nanotube layer includes at least one first carbon nanotube paper, and the density of the first carbon nanotube paper ranges from about 0.3 g/cm3 to about 1.4 g/cm3. An electronic device applying the heat-dissipation structure is also disclosed.
Public/Granted literature
- US20130160983A1 HEAT-DISSIPATION STRUCTURE AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2013-06-27
Information query
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