An isolation device for isolating a first signal of a first circuit from a second circuit disclosed. The isolation device may have a substrate and a plurality of metal layers disposed on the substrate. The plurality of metal layers have a topmost metal layer disposed furthest away from the substrate and a first interconnect metal layer formed nearest to the substrate. The first interconnect metal layer is disposed at a first distance away from the substrate, whereas the topmost metal layer is disposed at an isolation distance away from a first adjacent metal layer formed nearest to the topmost metal layer. A portion of the topmost metal layer forms a first plate. The first plate is configured to transmit the first signal from the first circuit to a second plate that is connected to the second circuit, but electrically isolated from the first plate.