Invention Grant
- Patent Title: Manufacturing method of vertical channel transistor array
- Patent Title (中): 垂直沟道晶体管阵列的制造方法
-
Application No.: US14271400Application Date: 2014-05-06
-
Publication No.: US09576963B2Publication Date: 2017-02-21
- Inventor: Yukihiro Nagai
- Applicant: Powerchip Technology Corporation
- Applicant Address: TW Hsinchu
- Assignee: Powerchip Technology Corporation
- Current Assignee: Powerchip Technology Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
A manufacturing method of a vertical channel transistor array is provided. The method includes following steps. A plurality of embedded word lines are formed at bottoms of trenches, and each of the embedded word lines is located at a first side wall of one of the trenches and connected to first sides of the semiconductor pillars in the same row. Each of the embedded word lines is not connected to second sides of the semiconductor pillars in the same row, and the first sides are opposite to the second sides. Only one embedded word line is correspondingly connected to the semiconductor pillars arranged in one row. An isolation structure is formed between a second side wall of each of the trenches and each of the embedded word lines. The first side wall is opposite to the second side wall.
Public/Granted literature
- US20140256104A1 MANUFACTURING METHOD OF VERTICAL CHANNEL TRANSISTOR ARRAY Public/Granted day:2014-09-11
Information query
IPC分类: