Invention Grant
US09577056B2 Semiconductor component comprising at least one contact structure for feeding in and/or leading away charge carriers 有权
半导体部件包括至少一个用于馈入和/或引导电荷载体的接触结构

Semiconductor component comprising at least one contact structure for feeding in and/or leading away charge carriers
Abstract:
A semiconductor component having at least one first contact structure for feeding in and/or leading away charge carriers in relation to the semiconductor component, which first contact structure has at least one contact-making point for electrically conductively connecting the first contact structure to an external terminal, and which first contact structure has at least one first-order branching point proceeding from the contact-making point, at which first-order branching point at least one first-order subsequent conduction track branches off. Each first-order subsequent conduction track has at least one second-order branching point, at which second-order branching point at least one second-order subsequent conduction track branches off, and the electrical through-conduction resistance of each second-order subsequent conduction track is higher than the electrical through-conduction resistance of the first-order subsequent conduction track connected to said second-order subsequent conduction track via a common second-order branching point.
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