Invention Grant
- Patent Title: Semiconductor apparatus
- Patent Title (中): 半导体装置
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Application No.: US13313583Application Date: 2011-12-07
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Publication No.: US09577087B2Publication Date: 2017-02-21
- Inventor: Yasuhiko Onishi , Akio Sugi
- Applicant: Yasuhiko Onishi , Akio Sugi
- Applicant Address: JP Kawasaki
- Assignee: FUI ELECTRIC CO., LTD.
- Current Assignee: FUI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Priority: JP2009-180131 20090731
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/08 ; H01L29/06 ; H01L29/40 ; H01L29/417

Abstract:
A semiconductor apparatus that has a first parallel pn-layer formed between an active region and an n+-drain region. A peripheral region is provided with a second parallel pn-layer, which has a repetition pitch narrower than the repetition pitch of the first parallel pn-layer. An n−-surface region is formed between the second parallel pn-layer and a first main surface. On the first main surface side of the n−-surface region, a plurality of p-guard ring regions are formed to be separated from each other. A field plate electrode is connected electrically to the outermost p-guard ring region among the p-guard ring regions. A channel stopper electrode is connected electrically to an outermost peripheral p-region of the peripheral region.
Public/Granted literature
- US20120126315A1 SEMICONDUCTOR APPARATUS Public/Granted day:2012-05-24
Information query
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