Invention Grant
- Patent Title: Light emitting diode chip
- Patent Title (中): 发光二极管芯片
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Application No.: US14240443Application Date: 2012-08-23
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Publication No.: US09577165B2Publication Date: 2017-02-21
- Inventor: Korbinian Perzlmaier , Kai Gehrke , Robert Walter , Karl Engl , Guido Weiss , Markus Maute , Stefanie Rammelsberger
- Applicant: Korbinian Perzlmaier , Kai Gehrke , Robert Walter , Karl Engl , Guido Weiss , Markus Maute , Stefanie Rammelsberger
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductor GmbH
- Current Assignee: OSRAM Opto Semiconductor GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102011112000 20110831
- International Application: PCT/EP2012/066462 WO 20120823
- International Announcement: WO2013/030094 WO 20130307
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/40 ; H01L33/42 ; H01L33/56 ; H01L33/38

Abstract:
A light emitting diode chip includes a semiconductor layer sequence having an active layer that generates electromagnetic radiation, wherein the light emitting diode chip has a radiation exit area at a front side, the light emitting diode chip has a mirror layer at least in regions at a rear side situated opposite the radiation exit area, said mirror layer containing silver, a protective layer is arranged on the mirror layer, and the protective layer comprises a transparent conductive oxide.
Public/Granted literature
- US20140319566A1 LIGHT EMITTING DIODE CHIP Public/Granted day:2014-10-30
Information query
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