Invention Grant
- Patent Title: Light emitting device and method for manufacturing the same
- Patent Title (中): 发光元件及其制造方法
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Application No.: US13707925Application Date: 2012-12-07
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Publication No.: US09577218B2Publication Date: 2017-02-21
- Inventor: Tomoyuki Kurihara
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2002-378668 20021226
- Main IPC: H01L33/38
- IPC: H01L33/38 ; H01L51/52 ; H05B33/04 ; H01L27/32

Abstract:
When attaching a substrate with an EL element formed thereon and a transparent sealing substrate, the periphery of a pixel portion is surrounded with a first sealing agent that maintains a gap between the two pieces of substrates, an entire surface of the pixel portion is covered with a second transparent sealing agent so that the two pieces of substrate is fixed with the first sealing agent and the second sealing agent. Consequently, the EL element can be encapsulated by curing the first sealing agent and the second sealing agent without enclosing a drying agent and doing damage to the EL element due to UV irradiation even when a sealing device only having a function of UV irradiation is used.
Public/Granted literature
- US20130092919A1 Light Emitting Device and Method for Manufacturing the Same Public/Granted day:2013-04-18
Information query
IPC分类: