Invention Grant
- Patent Title: Interconnecting structure for electrically connecting a first electronic device with a second electronic device
- Patent Title (中): 用于将第一电子设备与第二电子设备电连接的互连结构
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Application No.: US14204694Application Date: 2014-03-11
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Publication No.: US09577308B2Publication Date: 2017-02-21
- Inventor: Chun-Hsing Li , Chien-Nan Kuo , Chun-Lin Ko
- Applicant: National Chiao Tung University
- Applicant Address: TW
- Assignee: NATIONAL CHAIO TUNG UNIVERSITY
- Current Assignee: NATIONAL CHAIO TUNG UNIVERSITY
- Current Assignee Address: TW
- Agency: Volpe and Koenig, P.C.
- Priority: TW102133052A 20130912
- Main IPC: H01P5/02
- IPC: H01P5/02 ; H01P1/04 ; H01L23/00 ; H01P3/02 ; H01L23/64
Abstract:
An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.
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