An electrical connector for electrically connecting with a chip module includes an insulating body having a bottom wall, multiple rows of terminals located in the bottom wall for electrically connecting the chip module, and a carrier for carrying the chip module to the insulating body. Two first side walls extend from two opposite sides of the bottom wall upward, and two second side walls extend from the other two opposite sides of the bottom wall upward. There are a first gap between the first side wall and a most peripheral terminal corresponding to the first side wall, and a second gap between the second side wall and a most peripheral terminal corresponding to the second side wall. The first gap is greater than the second gap. The carrier has a buckling portion, received in the first gap, and for buckling a bottom surface of the chip module.