Invention Grant
- Patent Title: Pluggable LGA socket for high density interconnects
- Patent Title (中): 可插拔LGA插座,用于高密度互连
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Application No.: US14520530Application Date: 2014-10-22
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Publication No.: US09577361B2Publication Date: 2017-02-21
- Inventor: Alan F. Benner , Benjamin Vito Fasano , Paul Francis Fortier , Hilton T. Toy
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: DeLizion Law, PLLC
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/77 ; H01R4/50 ; H01R12/52 ; H01R12/71 ; H01R12/79

Abstract:
In some embodiments, an apparatus includes a land grid array connector positioned above an electrical package. The apparatus also includes a channel housing positioned above the land grid array. The apparatus includes an electrical-to-optical transceiver positioned in an opening of a socket of the channel housing, wherein a tapered opening is formed above the electrical-to-optical transceiver in the channel housing after the electrical-to-optical transceiver is positioned in the opening of the socket of the channel housing. A gap of the tapered opening decreases progressively starting from the opening of the socket. A conductive wedge positioned in the gap of the tapered opening.
Public/Granted literature
- US20160118731A1 PLUGGABLE LGA SOCKET FOR HIGH DENSITY INTERCONNECTS Public/Granted day:2016-04-28
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