Invention Grant
- Patent Title: Inverter assembly without galvanic isolation
- Patent Title (中): 逆变器组件无电隔离
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Application No.: US14745218Application Date: 2015-06-19
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Publication No.: US09577507B2Publication Date: 2017-02-21
- Inventor: Deokyoung Lim , Chun Suk Yang
- Applicant: LSIS CO., LTD.
- Applicant Address: KR Anyang-si
- Assignee: LSIS CO., LTD.
- Current Assignee: LSIS CO., LTD.
- Current Assignee Address: KR Anyang-si
- Agency: Lee, Hong, Degerman, Kang & Waimey
- Priority: KR10-2014-0093070 20140723
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H02M1/12 ; H02M7/00 ; H05K1/02 ; H05K1/11 ; H05K1/18

Abstract:
Disclosed is an inverter assembly without galvanic isolation, the inverter assembly including a PCB mounted with a power supply circuit unit, an inverter unit, an analogue circuit unit and a controller, a first ground circuit pattern to supply a ground power to the power supply circuit unit and the inverter unit, a second ground circuit pattern to supply the ground power to the analogue circuit unit, a third ground circuit pattern to supply the ground power to the controller, a first bead between the first ground circuit pattern and the second ground circuit pattern to isolate an impedance between the first ground circuit pattern and the second ground circuit pattern, and a second bead between the second ground circuit pattern and the third ground circuit pattern to isolate an impedance between the second ground circuit pattern and the third ground circuit pattern.
Public/Granted literature
- US20160028300A1 INVERTER ASSEMBLY WITHOUT GALVANIC ISOLATION Public/Granted day:2016-01-28
Information query