Invention Grant
- Patent Title: ICM foot-print with UPOE support
- Patent Title (中): 具有UPOE支持的ICM脚印
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Application No.: US14297681Application Date: 2014-06-06
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Publication No.: US09577887B2Publication Date: 2017-02-21
- Inventor: William Frank Edwards , Keith Frank Tharp , Ken Naumann , Amrik Bains , Clark Carty , Alan Yee , Arvind Kansal , Samir Bouadjel
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Merchant & Gould P.C.
- Main IPC: H04L12/28
- IPC: H04L12/28 ; H04B7/185 ; H04B7/00 ; G01R31/08 ; H04L12/24 ; H04L12/10 ; G06F13/40 ; H04L1/00 ; H04L5/14 ; H04L12/40 ; H04L12/931 ; H04L29/08 ; H04L12/935

Abstract:
Power Over Ethernet (POE)/universal power over Ethernet (UPoE) may be enabled at multigigabit port-channel connections. This may allow for additional speed support in auto-negotiation messages while employing multigigabit speeds. An integrated connector module (referred to herein as a “ICM”) compatible with UPoE with a modified local physical layer (PHY) circuit may be capable of supporting multi-gigabit data rates (such as between 1 G to 10 G, e.g., 2.5 G and 5 G) as to not limit the data rates to 1 G. The ICM may provide multi-gig data transmission through a first plurality of pins comprising a multi-gig data pin area. Furthermore, the ICM may provide UPoE power to support the multi-gig transmission through a second plurality of pins comprising a UPoE power pin area.
Public/Granted literature
- US20150172221A1 ICM Foot-Print with UPOE Support Public/Granted day:2015-06-18
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