Invention Grant
- Patent Title: Heat treatment apparatus and heat treatment method
- Patent Title (中): 热处理设备及热处理方法
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Application No.: US14799623Application Date: 2015-07-15
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Publication No.: US09578688B2Publication Date: 2017-02-21
- Inventor: Hidekazu Sato , Hideki Takahashi , Tsutomu Yamamoto
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2014-150438 20140724
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H05B3/00 ; H05B3/44 ; H01L21/67
Abstract:
There is provided a heat treatment apparatus, including: a processing container configured to perform a heat treatment on substrates accommodated in the processing container; a heating unit configured to cover an outer circumference of the processing container with a predetermined space defined the heating unit and the processing container; a discharge pipe installed outside of the processing container and within the predetermined space, and configured to communicate with an interior of the processing container to discharge an exhaust gas from the interior of the processing container; and a heat insulating member configured to cover a circumference of the discharge pipe.
Public/Granted literature
- US20160027661A1 HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD Public/Granted day:2016-01-28
Information query
IPC分类:
