Invention Grant
- Patent Title: Metal base substrate, power module, and method for manufacturing metal base substrate
- Patent Title (中): 金属基底，功率模块及制造金属基底的方法
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Application No.: US14615006Application Date: 2015-02-05
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Publication No.: US09578754B2Publication Date: 2017-02-21
- Inventor: Mariko Ono , Akira Goto , Rei Yoneyama , Takami Otsuki
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2014-102969 20140519
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H05K3/44 ; H01L23/043 ; H05K3/38 ; H01L23/495 ; H01L23/31 ; H01L23/29 ; H01L23/00 ; H01L21/48 ; H05K1/05 ; H05K1/09 ; H05K1/03 ; H01L23/14 ; H01L23/373 ; H01L23/48 ; H01L23/053 ; H01L23/24 ; H01L23/498
Abstract:
A metal base substrate of the present invention includes a copper plate made of copper, a metal layer that is formed on the copper plate and is made of a metal different from the copper, an insulating resin sheet that is formed by bonding a sheet made of an insulating resin onto the metal layer, and a circuit pattern formed on the insulating resin sheet.
Public/Granted literature
- US20150332982A1 METAL BASE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING METAL BASE SUBSTRATE Public/Granted day:2015-11-19
Information query
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