Invention Grant
- Patent Title: Slidable engagement of enclosure housings
- Patent Title (中): 外壳外壳可滑动接合
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Application No.: US14786313Application Date: 2013-07-18
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Publication No.: US09578757B2Publication Date: 2017-02-21
- Inventor: Steven Kamins Jacobs
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agent Robert Sismilich
- International Application: PCT/US2013/051052 WO 20130718
- International Announcement: WO2015/009304 WO 20150122
- Main IPC: H05K5/00
- IPC: H05K5/00 ; G06F1/18 ; G06F1/16
Abstract:
An enclosure having a first and second housing. The housings are slidably engaged along a first axis to form the enclosure. In one example, a compressed resilient member urges the housings together.
Public/Granted literature
- US20160120042A1 Slidable Engagement of Enclosure Housings Public/Granted day:2016-04-28
Information query
