Invention Grant
US09578760B2 Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same
有权
电路板，连接器，壳体，电路板组件，壳体组件，装置及其制造方法
- Patent Title: Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same
- Patent Title (中): 电路板，连接器，壳体，电路板组件，壳体组件，装置及其制造方法
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Application No.: US14721973Application Date: 2015-05-26
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Publication No.: US09578760B2Publication Date: 2017-02-21
- Inventor: Hyojae Bang , Dogeun Kim , Hongkyun Kim , Youngbok Jeon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2008-0088919 20080909
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K5/00 ; G06K7/00 ; H01R12/57 ; H01R12/50 ; H05K1/11 ; H01R13/00 ; H05K3/10 ; H05K3/30 ; H05K7/02 ; H05K13/00 ; G06F1/18 ; H05K1/18 ; H01R27/00 ; H05K1/02 ; H05K3/34
Abstract:
Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.
Public/Granted literature
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