Invention Grant
- Patent Title: Package for electronic device
- Patent Title (中): 电子设备包装
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Application No.: US14670973Application Date: 2015-03-27
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Publication No.: US09578770B2Publication Date: 2017-02-21
- Inventor: Akitada Kodama
- Applicant: Sumitomo Electric Device Innovations, Inc.
- Applicant Address: JP Yokohama-shi
- Assignee: Sumitomo Electric Device Innovations, Inc.
- Current Assignee: Sumitomo Electric Device Innovations, Inc.
- Current Assignee Address: JP Yokohama-shi
- Agency: Venable LLP
- Agent Michael A. Sartori
- Priority: JP2014-069749 20140328
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K5/06 ; H05K5/00 ; H01L23/10 ; H01L23/047
Abstract:
A package for an electronic device is disclosed. The package includes a metal base, an insulating casing mounted on the metal base and having a seating metal on the top thereof, and a lid tightly enclosing a space surrounded by the base and the casing. The lid provides a sealing metal facing the sealing metal on the top of the casing with putting a brazing metal therebetween. The sealing metal of the lid has an area wider than an area of the sealing metal of the casing.
Public/Granted literature
- US20150282366A1 PACKAGE FOR ELECTRONIC DEVICE Public/Granted day:2015-10-01
Information query
