Invention Grant
- Patent Title: Heat dissipation device, electronic device, and base station device
- Patent Title (中): 散热装置，电子装置和基站装置
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Application No.: US14669718Application Date: 2015-03-26
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Publication No.: US09578782B2Publication Date: 2017-02-21
- Inventor: Kenichi Uesugi , Yoshihisa Nakagawa , Atsushi Kaneko , Hiroshi Nakamura , Hideki Sonobe , Toshimitsu Kobayashi
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Arent Fox LLP
- Priority: JP2014-085514 20140417
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat dissipation device includes: a first plate with a first surface on which a first heat dissipation fin is formed; a second plate with a first surface on which a second heat dissipation fin is formed, and a heat conduction unit that passes through a first through-hole of the first plate and a second through-hole of the second plate.
Public/Granted literature
- US20150305200A1 HEAT DISSIPATION DEVICE, ELECTRONIC DEVICE, AND BASE STATION DEVICE Public/Granted day:2015-10-22
Information query
