Invention Grant
- Patent Title: Rack airflow conduit
- Patent Title (中): 机架气流导管
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Application No.: US14527131Application Date: 2014-10-29
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Publication No.: US09578784B2Publication Date: 2017-02-21
- Inventor: Daniel Stellick , Timothy Hopkins , Erics Lai
- Applicant: Allied Telesis Holdings Kabushiki Kaisha , ALLIED TELESIS, INC.
- Applicant Address: JP Tokyo
- Assignee: ALLIED TELESIS HOLDINGS KABUSHIKI KAISHA
- Current Assignee: ALLIED TELESIS HOLDINGS KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Brooks Acordia IP Law, P.C.
- Agent Michael Zarrabian
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
Provided is an apparatus including a frame a conduit coupled to the frame. The conduit is configured to adjustably extend from the frame, thereby providing a channel between the frame and a side of the server rack. The channel is configured to substantially thermally isolate a flow of gas through the channel.
Public/Granted literature
- US20160128226A1 RACK AIRFLOW CONDUIT Public/Granted day:2016-05-05
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