Invention Grant
- Patent Title: System and method for extracting components
- Patent Title (中): 用于提取组件的系统和方法
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Application No.: US14621876Application Date: 2015-02-13
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Publication No.: US09578795B2Publication Date: 2017-02-21
- Inventor: Lei Zhang , Ming-Tong Wang
- Applicant: LTG Green-Tech R&D Company Limited
- Applicant Address: HK
- Assignee: Li Tong (H.K.) Telecom Company Limited
- Current Assignee: Li Tong (H.K.) Telecom Company Limited
- Current Assignee Address: HK
- Agency: Renner Kenner Greive Bobak Taylor & Weber
- Priority: HK14101452.3 20140214
- Main IPC: B32B38/10
- IPC: B32B38/10 ; H05K13/04 ; B23K1/018 ; H05K3/22 ; B23K1/00 ; B32B43/00
Abstract:
A method for extracting components includes the steps of heating an electronic device having one or more components to a predetermined temperature so as to substantially weaken a bonding substance arranged to bond the one or more components to the electronic device, and thereafter manipulating the electronic device to extract the one or more components from the electronic device.
Public/Granted literature
- US20150237774A1 SYSTEM AND METHOD FOR EXTRACTING COMPONENTS Public/Granted day:2015-08-20
Information query
