Invention Grant
- Patent Title: Pharmaceutical composition for relieving pain
- Patent Title (中): 用于缓解疼痛的药物组合物
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Application No.: US14452324Application Date: 2014-08-05
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Publication No.: US09579342B2Publication Date: 2017-02-28
- Inventor: Hiroyuki Hosokawa , Sooyeol Lim , Junko Takamura
- Applicant: Seikagaku Corporation
- Applicant Address: JP Tokyo
- Assignee: Seikagaku Corporation
- Current Assignee: Seikagaku Corporation
- Current Assignee Address: JP Tokyo
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Christopher R. Cowles
- Priority: JP2009-187899 20090813
- Main IPC: A61K31/728
- IPC: A61K31/728 ; A61K31/738 ; A61K9/00

Abstract:
The present invention relates to a pharmaceutical composition for relieving pain in a joint disease, including a hyaluronic acid and a pharmaceutically acceptable carrier, in which the hyaluronic acid is cross-linked by cyclizing a double bond in the moiety of a cinnamic acid in a partially amidated hyaluronic acid represented by Formula (1): [Ar—CH═CH—COO—(CH2)n-NH-]m-HA, to form a cycloubutane ring, in which Ar represents an optionally substituted phenyl group, n represents an integer of 2 or 3, HA represents a carboxy residue of the hyaluronic acid, and m represents an amidation ratio of the hyaluronic acid to the total carboxyl group and is in the range of 3 to 50% relative to the total carboxyl group.The pharmaceutical composition of the present invention is an intra-articular formulation that exerts rapid analgesic effects after administration, and shows extremely long durable effects for a human joint disease with only a single administration rather than multiple administrations of a conventional way.
Public/Granted literature
- US20140350239A1 PHARMACEUTICAL COMPOSITION FOR RELIEVING PAIN Public/Granted day:2014-11-27
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