Invention Grant
- Patent Title: Peeling machine
- Patent Title (中): 剥皮机
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Application No.: US14255496Application Date: 2014-04-17
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Publication No.: US09579726B2Publication Date: 2017-02-28
- Inventor: Shoji Yoshizuru
- Applicant: Daisho Seiki Corporation
- Applicant Address: JP Ikeda-shi
- Assignee: Daisho Seiki Corporation
- Current Assignee: Daisho Seiki Corporation
- Current Assignee Address: JP Ikeda-shi
- Agency: Crowell & Moring LLP
- Priority: JP2013-089635 20130422
- Main IPC: B23B5/12
- IPC: B23B5/12 ; A47J17/16

Abstract:
A peeling machine according to the present invention includes a cutter head and a feed mechanism having upper and lower feed rollers, and the feed mechanism includes a first holder that supports the lower feed roller, a second holder that supports the upper feed roller, a roller opening/closing driving mechanism, a synchronizing mechanism that has a pinion disposed in the same vertical plane as axes of the both feed rollers and first and second racks, and a grasping-force applying cylinder that applies a downward work grasping force to the second holder.
Public/Granted literature
- US20140311362A1 Peeling Machine Public/Granted day:2014-10-23
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