Invention Grant
- Patent Title: Thermal processing apparatus
- Patent Title (中): 热处理设备
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Application No.: US14430526Application Date: 2013-09-06
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Publication No.: US09579740B2Publication Date: 2017-02-28
- Inventor: Hiroshi Akama , Yutaka Matsumoto , Masami Kuroda , Hironobu Nishimura
- Applicant: ORIGIN ELECTRIC COMPANY, LIMITED
- Applicant Address: JP Saitama-shi, Saitama
- Assignee: Origin Electric Company, Limited
- Current Assignee: Origin Electric Company, Limited
- Current Assignee Address: JP Saitama-shi, Saitama
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2012-213435 20120927
- International Application: PCT/JP2013/074093 WO 20130906
- International Announcement: WO2014/050508 WO 20140403
- Main IPC: A21B2/00
- IPC: A21B2/00 ; F26B3/30 ; B23K3/04 ; B23K1/008 ; H05B3/44 ; B23K1/00 ; B23K1/005 ; H05B3/00

Abstract:
To provide a thermal processing apparatus where a projection area perpendicular to the axis of a sealing structure and attachment structure of heat radiation heater is decreased and a chamber volume is decreased. The apparatus has a chamber for accommodating a workpiece of a thermal processing object, the chamber having a partition wall for partitioning inside from outside of the chamber, a heat radiation heater disposed penetrating the partition wall, wherein the heater has a ring seal arranged on an outer peripheral surface of the extension section, and hermetically sealing the chamber, and a heat blocking plate arranged between the heat radiation unit and the ring seal in the axial direction of the glass tube, for blocking heat radiated from the heat radiation unit to the ring seal, the heat blocking plate having an inner peripheral surface fitting along the extension section.
Public/Granted literature
- US20150246405A1 THERMAL PROCESSING APPARATUS Public/Granted day:2015-09-03
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