Invention Grant
- Patent Title: Cutting apparatus
- Patent Title (中): 切割设备
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Application No.: US14110657Application Date: 2012-04-09
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Publication No.: US09579813B2Publication Date: 2017-02-28
- Inventor: Hidenobu Yamagishi , Takahiro Niwa , Masaki Yoshihara
- Applicant: Hidenobu Yamagishi , Takahiro Niwa , Masaki Yoshihara
- Applicant Address: JP Tokyo
- Assignee: NICHIAS CORPORATION
- Current Assignee: NICHIAS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2011-089766 20110414
- International Application: PCT/JP2012/059677 WO 20120409
- International Announcement: WO2012/141132 WO 20121018
- Main IPC: B26D3/16
- IPC: B26D3/16 ; B29C49/42 ; B26D7/01 ; B26D1/09

Abstract:
Provided is a cutting apparatus 10 including a workpiece fixing jig 2 that supports a workpiece 1, rotates by operation of rotary drive means 3, and rotates the workpiece 1 while fixing the workpiece 1; rotary drive means 3 for driving and rotating the workpiece fixing jig 2; support means 4a to 4c for supporting the workpiece 1 while rotating along with rotation of the workpiece fixing jig 2; cutter knives 5a and 5b that cut the rotating workpiece 1 at least at axially opposite ends of the workpiece 1; and slide moving means 6 for slidably moving the cutter knives. The cutting apparatus 10 having a simple apparatus configuration does not produce chips as a result of cutting with small variations in size and with high planarity of cut surfaces.
Public/Granted literature
- US20140076116A1 CUTTING APPARATUS Public/Granted day:2014-03-20
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