Invention Grant
- Patent Title: Ultrasonic sealing of packages
- Patent Title (中): 包装的超声波密封
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Application No.: US14853269Application Date: 2015-09-14
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Publication No.: US09579845B2Publication Date: 2017-02-28
- Inventor: Pak Meng Cham , Glenn T. Jordan, IV , Austin Kozman , Sean Flowers , Matthew A. Short
- Applicant: EWI, Inc. (Edison Welding Institute, Inc.)
- Applicant Address: US OH Columbus
- Assignee: EWI (Edison Welding Institute, Inc.)
- Current Assignee: EWI (Edison Welding Institute, Inc.)
- Current Assignee Address: US OH Columbus
- Agency: McNees Wallace & Nurick LLC
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B29C65/08 ; B29C65/82 ; B29C65/00 ; B65B51/22 ; B29C65/74 ; B29C65/78 ; B65B51/30 ; B65B9/213
Abstract:
A method and apparatus for sealing films. In one embodiment the sealing device comprises a horn and an anvil. The film has a standard portion and an increased portion. Increased energy is applied to the film in the increased portion compared to the energy applied to the standard portion. Such a method allows for sealing of varying number of layers.
Public/Granted literature
- US20160001499A1 Ultrasonic Sealing of Packages Public/Granted day:2016-01-07
Information query
