A method uses a first mask which is comprised of an X-shaped arm, a pattern portion which is a crossed part of the X-shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion, and a second mask which is comprised of a cross-shaped arm, a pattern portion which is a crossed part of the cross shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion; and includes a first transparent member wafer metal film-forming step of superimposing the first mask on one transparent member wafer between two transparent member wafers and forming a metal film between the pattern portions and the frame members, a second transparent member wafer metal film-forming step of superimposing the second mask on the other transparent member wafer.