Invention Grant
- Patent Title: Gluing device
- Patent Title (中): 胶合装置
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Application No.: US14819944Application Date: 2015-08-06
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Publication No.: US09579872B2Publication Date: 2017-02-28
- Inventor: Hiroshi Saito
- Applicant: KABUSHIKI KAISHA ISOWA
- Applicant Address: JP Aichi
- Assignee: KABUSHIKI KAISHA ISOWA
- Current Assignee: KABUSHIKI KAISHA ISOWA
- Current Assignee Address: JP Aichi
- Agency: Brinks Gilson & Lione
- Priority: JP2014-166810 20140819
- Main IPC: B29C65/52
- IPC: B29C65/52 ; B32B37/12 ; B32B39/00 ; B32B37/00 ; B05C1/08 ; B32B7/12 ; B32B29/00 ; B32B3/28 ; B05C1/16 ; B31F1/28

Abstract:
Disclosed is a gluing device including a reservoir tank of liquid glue; an applicator roll partially immersed in the liquid glue; a doctor roll for adjusting a thickness of the liquid glue adhered to the applicator roll to become uniform; and a pair of glue dams for regulating a width of the liquid glue adherable to the applicator roll. The gluing device is configured to apply the adhered liquid glue on the applicator roll to a corrugated medium of a corrugated paperboard sheet. Each of the glue dams includes a pair of dam units located in spaced-apart relation to each other in a width direction of the applicator roll. The pair of dam units are configured to form a glue-uncoated region interposed between the pair of dam units on an outer peripheral surface of the applicator roll so as to correspond to a trimming region of the corrugated paperboard sheet.
Public/Granted literature
- US20160052249A1 GLUING DEVICE Public/Granted day:2016-02-25
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