Invention Grant
- Patent Title: Wiring harness assembly of door module
- Patent Title (中): 门模组接线组件
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Application No.: US15014162Application Date: 2016-02-03
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Publication No.: US09580027B2Publication Date: 2017-02-28
- Inventor: Jae Won Lee , Jae In Yu , Hang Chul Ko , Sung Ik Cho , Hue Yeon An
- Applicant: Jae Won Lee , Jae In Yu , Hang Chul Ko , Sung Ik Cho , Hue Yeon An
- Applicant Address: KR
- Assignee: Seoyon E-Hwa Co., Ltd.
- Current Assignee: Seoyon E-Hwa Co., Ltd.
- Current Assignee Address: KR
- Agency: Tarolli, Sundheim, Covell & Tummino LLP
- Priority: KR1020150016589 20150203
- Main IPC: B60R16/02
- IPC: B60R16/02 ; B60J5/04
Abstract:
A wiring harness assembly of a door module, includes: an FPCB (Flexible Printed Circuit Board) connected to an external power supply for supplying electricity to a plurality of electric devices installed on the door module; a cover member coupled to the FPCB while protecting the FPCB; and a rib for protecting the FPCB from water.
Public/Granted literature
- US20160221517A1 WIRING HARNESS ASSEMBLY OF DOOR MODULE Public/Granted day:2016-08-04
Information query
