The present disclosure provides a wire buffer device. The wire buffer device comprises: a frame; and multiple of support layers provided to the frame and arranged in layers. Each of the support layers includes multiple sections of wires that support a substrate. The multiple sections of wires are in the form of at least one integrated wire. The wire buffer device further includes at least one transmission structure. Said at least one transmission structure drives each of said at least one integrated wire to perform a reciprocating motion so that at least a part of each of said at least one integrated wire moves into or moves out from the frame. For the wire buffer device, work operability is improved, and secondary contamination to the device is avoided.