Invention Grant
- Patent Title: Adhesive compound
- Patent Title (中): 粘合剂
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Application No.: US14823035Application Date: 2015-08-11
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Publication No.: US09580630B2Publication Date: 2017-02-28
- Inventor: Edwin Welles , Leonard Van Beugen , Gerhard Maier , Martin Mayershofer
- Applicant: J. van Beugen Beheer B.V.
- Applicant Address: NL Hellevoetsluis
- Assignee: J. VAN BEUGEN BEHEER B.V.
- Current Assignee: J. VAN BEUGEN BEHEER B.V.
- Current Assignee Address: NL Hellevoetsluis
- Agency: Hoyng Rokh Monegier LLP
- Agent Ramin Amirsehhi; David P. Owen
- Priority: EP08172868 20081223
- Main IPC: A61K9/16
- IPC: A61K9/16 ; C09J123/12 ; C09D123/12 ; C08K3/26 ; C08K3/04 ; C08K3/22 ; C09J123/10

Abstract:
An adhesive compound consisting essentially of an organic phase and inorganic phase, the organic phase comprising an amorphous aliphatic (co)polymer having a Ring & Ball softening point of between 75 and 180° C., and a second aliphatic material having a Tg of about −5° C. or lower and a kinematic viscosity of 4500 mm2/s at 100° C. or less, wherein said organic components are present in weight amounts of between 95/5 and 10/90; the inorganic phase comprising a filler, the filler being present in amount of at least about 15 wt % in the total composition. The compositions are suitable for anti-corrosion coatings or sealants against filtration or penetration of water or moisture. A rubber material may be added to this compound or other anti-corrosion coatings to increase the yield point at high temperatures.
Public/Granted literature
- US20150344745A1 ADHESIVE COMPOUND Public/Granted day:2015-12-03
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