Invention Grant
- Patent Title: System for forming floor underlayment
- Patent Title (中): 用于成型地板垫的系统
-
Application No.: US15212523Application Date: 2016-07-18
-
Publication No.: US09580917B2Publication Date: 2017-02-28
- Inventor: Akiva Pinto , Chad A. Collison
- Applicant: Akiva Pinto , Chad A. Collison
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: B32B21/10
- IPC: B32B21/10 ; E04F15/22 ; E04C2/16 ; E04C2/24 ; E04B1/66 ; E04F15/18

Abstract:
A process for making a fibrous panel member and a flooring structure is disclosed. The flooring structure has a subfloor, a surface layer, and an insulative pad disposed between the subfloor and the surface layer. The insulative pad has an MDI binder and reinforcement fibers distributed uniformly and randomly within a first plane. The process includes mixing a porous fiber material with a MDI adhesive. The fiber batt is compressed between a pair of porous belts. Steam and heat are applied to the compressed batt to form a bound flexible batting material.
Public/Granted literature
- US20160326753A1 SYSTEM FOR FORMING FLOOR UNDERLAYMENT Public/Granted day:2016-11-10
Information query