A differential pressure sensor has a sensor chip that is, between a first inner wall surface and a second inner wall surface of a sensor chamber, joined by a first adhesive agent layer between one face of the sensor chip and the first inner wall surface of the sensor chamber and joined through a second adhesive agent layer between other face of the sensor chip and the second inner wall surface of the sensor chamber. The first adhesive agent layer is an adhesive agent layer that has a Young's modulus that is smaller than the Young's modulus of a material that structures a sensor diaphragm. The second adhesive agent layer is an adhesive agent layer that has a Young's modulus that is smaller than the Young's modulus of the material that structures the sensor diaphragm and larger than the Young's modulus of the first adhesive agent layer.