Invention Grant
- Patent Title: Modular hardness testing machine
- Patent Title (中): 模块化硬度试验机
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Application No.: US14246492Application Date: 2014-04-07
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Publication No.: US09581533B2Publication Date: 2017-02-28
- Inventor: Shaoming Wu , Richard Wu
- Applicant: Shaoming Wu , Richard Wu
- Agent Clement Cheng
- Main IPC: G01N3/42
- IPC: G01N3/42

Abstract:
A modular hardness testing machine has a measuring component and a set of frames. The measuring component includes a housing and locating slot. The measuring component has a locating slot configured to receive a frame. The locating slot allows a user to modularly interchange the frame. The measuring component's housing encloses a presshead, which encloses a load cell having through-holes holding transmission pins. The first end of each transmission pin contacts a displacement measurement sleeve, and a second end contacts a transmission plate. A motor is mounted to the housing. The motor is connected to a reduction drive. The reduction drive reduces speed and drives a lead screw mounted on a bearing mount, and a moveable presshead is driven by the lead screw.
Public/Granted literature
- US20150285722A1 MODULAR HARDNESS TESTING MACHINE Public/Granted day:2015-10-08
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