Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US15077394Application Date: 2016-03-22
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Publication No.: US09582019B2Publication Date: 2017-02-28
- Inventor: Hiroyuki Kikuta
- Applicant: LAPIS SEMICONDUCTOR CO., LTD.
- Applicant Address: JP Yokohama
- Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee Address: JP Yokohama
- Agency: Volentine & Whitt, PLLC
- Priority: JP2015-063255 20150325
- Main IPC: H03L5/00
- IPC: H03L5/00 ; G05F1/625 ; H03M1/12

Abstract:
The present disclosure provides a semiconductor device including: a resistance section that includes a first terminal and a second terminal disposed in contact with an outer periphery, and a serial resistance section in which plural resistance elements are connected in series, wherein one end of the serial resistance section is connected to the first terminal, and another end of the serial resistance section is connected to the second terminal; and a current adjustment section that includes a current source that supplies current to the serial resistance section, and disposed adjacent to the resistance section such that a distance between the first terminal and the current adjustment section along the outer periphery of the resistance section and a distance between the second terminal and the current adjustment section along the outer periphery of the resistance section are equal.
Public/Granted literature
- US20160282891A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-09-29
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