Invention Grant
- Patent Title: Shock absorption structure and electronic device with same
- Patent Title (中): 冲击吸收结构和电子装置相同
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Application No.: US14690011Application Date: 2015-04-17
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Publication No.: US09582044B2Publication Date: 2017-02-28
- Inventor: Kuan-Chang Lin , Chia-Che Chang
- Applicant: Chiun Mai Communication Systems, Inc.
- Applicant Address: TW New Taipei
- Assignee: Chiun Mai Communication Systems, Inc.
- Current Assignee: Chiun Mai Communication Systems, Inc.
- Current Assignee Address: TW New Taipei
- Agent Zhigang Ma
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F1/18
Abstract:
A shock absorption structure includes a receiving portion and at least one shock absorption assembly. The receiving portion is configured to receive a main body of an electronic device. Each shock absorption assembly includes a fixing member, a mounting member, and an elastic member. The fixing member is secured to the receiving portion. The mounting member is mounted to the fixing member and defines a through hole. The elastic member is received in the through hole and is configured to seals a gap between the mounting member and the main body.
Public/Granted literature
- US20160216740A1 SHOCK ABSORPTION STRUCTURE AND ELECTRONIC DEVICE WITH SAME Public/Granted day:2016-07-28
Information query
