Invention Grant
- Patent Title: Lead frame
- Patent Title (中): 引线架
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Application No.: US15002640Application Date: 2016-01-21
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Publication No.: US09583422B2Publication Date: 2017-02-28
- Inventor: Katsuyuki Doumae , Yoshio Ichihara , Shimpei Sasaoka
- Applicant: SH MATERIALS CO., LTD. , NICHIA CORPORATION
- Applicant Address: JP Tokyo JP Tokushima
- Assignee: SH MATERIALS CO., LTD.,NICHIA CORPORATION
- Current Assignee: SH MATERIALS CO., LTD.,NICHIA CORPORATION
- Current Assignee Address: JP Tokyo JP Tokushima
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2015-010391 20150122
- Main IPC: H01L23/495
- IPC: H01L23/495

Abstract:
A lead frame, as one product unit in a multi-row lead frame sharing a partition frame among other lead frames, has a non-mirrorsymmetric pad region and at least one terminal region arranged inside and held to a rectangular outer frame region, which is a part of the partition frame and forms a boundary of the lead frame as a product unit, via respective suspension leads. Only two suspension leads hold the non-mirrorsymmetric pad region to the outer frame region as extending from opposite sides of the outer frame region to the non-mirrorsymmetric pad region, respectively. This structure decreases stress resulting from holding of the non-mirrorsymmetric pad region to the outer frame region and thus can prevent the outer frame region from deformation without widened connecting bars or dambars, which form the outer frame region.
Public/Granted literature
- US20160218051A1 LEAD FRAME Public/Granted day:2016-07-28
Information query
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