Invention Grant
- Patent Title: Embedding thin chips in polymer
- Patent Title (中): 将薄片嵌入聚合物
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Application No.: US14859112Application Date: 2015-09-18
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Publication No.: US09583428B2Publication Date: 2017-02-28
- Inventor: Conor Rafferty , Mitul Dalal
- Applicant: MC10, Inc.
- Applicant Address: US MA Lexington
- Assignee: MC10, Inc.
- Current Assignee: MC10, Inc.
- Current Assignee Address: US MA Lexington
- Agency: Nixon Peabody LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/498 ; H01L23/538 ; H01L23/31 ; H01L23/16 ; H01L21/56 ; H01L23/00 ; H01L21/683 ; H05K1/02 ; H05K1/18
Abstract:
Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.
Public/Granted literature
- US20160111353A1 EMBEDDING THIN CHIPS IN POLYMER Public/Granted day:2016-04-21
Information query
IPC分类:
