Invention Grant
- Patent Title: Methods for bonding a hermetic module to an electrode array
- Patent Title (中): 将密封模块粘合到电极阵列的方法
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Application No.: US13836582Application Date: 2013-03-15
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Publication No.: US09583458B2Publication Date: 2017-02-28
- Inventor: Tirunelveli Sriram , Brian Smith , Bryan Mclaughlin , John Lachapelle
- Applicant: The Charles Stark Draper Laboratory, Inc.
- Applicant Address: US MA Cambridge
- Assignee: The Charles Stark Draper Laboratory, Inc.
- Current Assignee: The Charles Stark Draper Laboratory, Inc.
- Current Assignee Address: US MA Cambridge
- Agency: Nutter McClennen & Fish LLP
- Agent John J. Penny, V.; Ashley T. Brzezinski
- Main IPC: H01K3/10
- IPC: H01K3/10 ; H01L23/00 ; A61N1/375 ; A61B5/00 ; H01L23/13 ; H01L23/14 ; H01L23/31 ; A61B5/04 ; A61N1/05 ; H01L25/065 ; H01L23/498
Abstract:
A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.
Public/Granted literature
- US20140273345A1 METHODS FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY Public/Granted day:2014-09-18
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