Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US14840732Application Date: 2015-08-31
-
Publication No.: US09583577B2Publication Date: 2017-02-28
- Inventor: Chisato Furukawa , Masaaki Ogawa , Takako Motai , Wakana Nishiwaki
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2015-051489 20150313
- Main IPC: H01L29/32
- IPC: H01L29/32 ; H01L29/778 ; H01L29/66 ; H01L29/06 ; H01L29/40 ; H01L29/417 ; H01L29/20

Abstract:
A semiconductor device includes a substrate, a first nitride semiconductor layer on the substrate, a second nitride semiconductor layer on the first nitride semiconductor layer, a third nitride semiconductor layer on the second nitride semiconductor layer, an electrode on the third nitride semiconductor layer, and an insulating layer under the electrode and between the first nitride semiconductor layer and the second nitride semiconductor layer.
Public/Granted literature
- US20160268380A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-09-15
Information query
IPC分类: