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US09583577B2 Semiconductor device and manufacturing method thereof 有权
半导体装置及其制造方法

Semiconductor device and manufacturing method thereof
Abstract:
A semiconductor device includes a substrate, a first nitride semiconductor layer on the substrate, a second nitride semiconductor layer on the first nitride semiconductor layer, a third nitride semiconductor layer on the second nitride semiconductor layer, an electrode on the third nitride semiconductor layer, and an insulating layer under the electrode and between the first nitride semiconductor layer and the second nitride semiconductor layer.
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