Invention Grant
US09583690B2 LED lampwick, LED chip, and method for manufacturing LED chip 有权
LED lampwick,LED芯片,以及制造LED芯片的方法

LED lampwick, LED chip, and method for manufacturing LED chip
Abstract:
An LED lamp core, an LED chip, and a method for manufacturing the LED chip are provided. A heat conductive core (6) using the structure of taper column or taper threaded column can be conveniently installed, and solves the heat conductive problem from the standardization of the LED lamp core. A heat diffusion plate (2) is made of copper or aluminum, and the area and the thickness thereof should be large enough, so as to achieve the effect of heat diffusion. A wafer (1) is welded on the heat diffusion plate (2), reducing the temperature difference between the wafer (1) and the heat diffusion plate (2) is primary and the insulation between the same is secondary. A high voltage insulation layer (4), which is required for safety, is provided between the heat diffusion plate (2) and the heat conductive core (6), and the heat flux density between the heat diffusion plate (2) and the heat conductive core (6) has already been reduced by the heat diffusion plate (2). The technique using a wafer locating plate solves the problem of aligning weld, costly equipment and low production efficiency.
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