Invention Grant
US09583690B2 LED lampwick, LED chip, and method for manufacturing LED chip
有权
LED lampwick,LED芯片,以及制造LED芯片的方法
- Patent Title: LED lampwick, LED chip, and method for manufacturing LED chip
- Patent Title (中): LED lampwick,LED芯片,以及制造LED芯片的方法
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Application No.: US13636661Application Date: 2010-04-07
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Publication No.: US09583690B2Publication Date: 2017-02-28
- Inventor: Biao Qin
- Applicant: Biao Qin
- Applicant Address: CN Shenzhen, Guangdong Province
- Assignee: Shenzhen Qin Bo Core Technology Development Co., Ltd.
- Current Assignee: Shenzhen Qin Bo Core Technology Development Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province
- Agency: Novoclaims Patent Services LLC
- International Application: PCT/CN2010/071583 WO 20100407
- International Announcement: WO2011/124019 WO 20111013
- Main IPC: F21S4/00
- IPC: F21S4/00 ; F21V21/00 ; H01L33/64 ; F21V29/89 ; F21V23/00 ; F21Y101/00

Abstract:
An LED lamp core, an LED chip, and a method for manufacturing the LED chip are provided. A heat conductive core (6) using the structure of taper column or taper threaded column can be conveniently installed, and solves the heat conductive problem from the standardization of the LED lamp core. A heat diffusion plate (2) is made of copper or aluminum, and the area and the thickness thereof should be large enough, so as to achieve the effect of heat diffusion. A wafer (1) is welded on the heat diffusion plate (2), reducing the temperature difference between the wafer (1) and the heat diffusion plate (2) is primary and the insulation between the same is secondary. A high voltage insulation layer (4), which is required for safety, is provided between the heat diffusion plate (2) and the heat conductive core (6), and the heat flux density between the heat diffusion plate (2) and the heat conductive core (6) has already been reduced by the heat diffusion plate (2). The technique using a wafer locating plate solves the problem of aligning weld, costly equipment and low production efficiency.
Public/Granted literature
- US20130010481A1 LED Lampwick, LED Chip, and Method for Manufacturing LED Chip Public/Granted day:2013-01-10
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