Invention Grant
- Patent Title: Systems and methods for scalable perovskite device fabrication
- Patent Title (中): 可扩展钙钛矿器件制造的系统和方法
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Application No.: US15009718Application Date: 2016-01-28
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Publication No.: US09583724B2Publication Date: 2017-02-28
- Inventor: Jinsong Huang , Qingfeng Dong , Yuchuan Sao
- Applicant: NUtech Ventures
- Applicant Address: US NE Lincoln
- Assignee: NUtech Ventures
- Current Assignee: NUtech Ventures
- Current Assignee Address: US NE Lincoln
- Agency: Leydig, Voit & Mayer, LTD
- Main IPC: H01L51/42
- IPC: H01L51/42 ; H01L51/44 ; H01L51/00
Abstract:
Continuous processes for fabricating a perovskite device are described that include using a doctor blade for continuously forming a perovskite layer and using a conductive tape lamination process to form an anode or a cathode layer on the perovskite device.
Public/Granted literature
- US20160218307A1 SYSTEMS AND METHODS FOR SCALABLE PEROVSKITE DEVICE FABRICATION Public/Granted day:2016-07-28
Information query
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