Invention Grant
- Patent Title: Wireless module
- Patent Title (中): 无线模块
-
Application No.: US14428666Application Date: 2014-06-10
-
Publication No.: US09583817B2Publication Date: 2017-02-28
- Inventor: Kentaro Watanabe , Yuichi Kashino , Suguru Fujita , Kohei Sugimoto , Ryosuke Shiozaki
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Seed IP Law Group LLP
- Priority: JP2013-132929 20130625
- International Application: PCT/JP2014/003080 WO 20140610
- International Announcement: WO2014/208027 WO 20141231
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/27 ; H01Q1/42

Abstract:
A wireless device that suppresses deterioration of antenna characteristics and can be made thin is provided. The wireless device is provided with a substrate, a wireless module that is mounted on the substrate and has an antenna unit, and a casing that accommodates the substrate and the wireless module. The wireless device has a gap of a length that is an approximate multiple of a half-wavelength of a radio wave corresponding to a communication frequency of the antenna unit, from the antenna unit toward the casing.
Public/Granted literature
- US20150249283A1 WIRELESS MODULE Public/Granted day:2015-09-03
Information query