Invention Grant
US09583891B2 High-density electrical connector for plural multi-contact linear-array connections
有权
用于多个多点线性阵列连接的高密度电连接器
- Patent Title: High-density electrical connector for plural multi-contact linear-array connections
- Patent Title (中): 用于多个多点线性阵列连接的高密度电连接器
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Application No.: US14735487Application Date: 2015-06-10
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Publication No.: US09583891B2Publication Date: 2017-02-28
- Inventor: Ronald J. Pulvermacher
- Applicant: Ad-Tech Medical Instrument Corporation
- Applicant Address: US WI Racine
- Assignee: Ad-Tech Medical Instrument Corp.
- Current Assignee: Ad-Tech Medical Instrument Corp.
- Current Assignee Address: US WI Racine
- Agency: McKinley & Kirby Ltd.
- Agent Jansson Munger
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00 ; H01R13/66

Abstract:
An electrical connector for connecting plural multi-contact linear arrays with an electrical system, including: a base portion having a base member and an alignment member on the base member configured to hold the multi-contact linear arrays in place; an interconnect portion configured to mate with the base portion and having (1) a plurality of pins mounted thereto, each pin positioned for contact with a respective contact of the multi-contact linear arrays, and (2) an interconnect array having a plurality of conductive pathways to the electrical system; and one or more closure elements for holding the base and interconnect portions together, wherein each of the contacts of the multi-contact linear arrays is electrically connected to a corresponding point in circuits within the electrical system.
Public/Granted literature
- US20160365677A1 High-Density Electrical Connector for Plural Multi-Contact Linear-Array Connections Public/Granted day:2016-12-15
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