Invention Grant
- Patent Title: Mounting structure of electronic component
- Patent Title (中): 电子元器件的安装结构
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Application No.: US14822181Application Date: 2015-08-10
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Publication No.: US09583928B2Publication Date: 2017-02-28
- Inventor: Yukihiro Kawamura
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-164379 20140812
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H02G3/18 ; B60R16/023

Abstract:
A mounting structure of an electronic component includes an electronic component, a housing member, a counterpart terminal, and at least one locking mechanism. The electronic component includes: an electronic component main body; a housing formed by assembling a casing member in which a chamber for the electronic component main body is formed and a base member to which the electronic component main body is attached; and a terminal exposed from the chamber to outside of the housing. The housing member includes a housing space including: a first chamber that accommodates the housing; and a second chamber that accommodates a terminal. The counterpart terminal is fitted into the second chamber and electrically coupled to the terminal. The locking mechanism maintains the accommodation state of the electronic component to the housing member by engaging a first engaging part and a second engaging part.
Public/Granted literature
- US20160050779A1 MOUNTING STRUCTURE OF ELECTRONIC COMPONENT Public/Granted day:2016-02-18
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